PulseCube – UV Laser Micromachining
New generation of Laser Drilling Machine
Note: Online demonstration available upon request - Contact us at sales@almax-easylab.com to book a 30' online introduction to the PulseCube.
- 355 nm UV laser precision micromachining system;
- Gasket drilling in diamond anvil cells;
- Sample cutting and mask fabrication for electrodes’ deposition;
- Achieve cleaner cuts and higher accuracy with advanced UV laser technology;
- Work seamlessly with a wide range of conductive and non-conductive materials;
- Simplify workflows through intuitive, fully software-controlled operation;
- Ensure maximum safety with a compact, fully enclosed Class 1 laser system.
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Description
The PulseCube is a precision micromachining system designed for gasket drilling in diamond anvil cells, sample cutting, and mask fabrication for electrodes’ deposition.
Designed for demanding research environments, it is an indispensable tool for laboratories specialising in high-pressure science or advanced materials research, where dimensional accuracy at the micron scale is essential.
Its key advantage is a 355 nm UV laser that ablates material rather than melting it, unlike conventional IR lasers. This minimises thermal effects, producing cleaner surfaces, sharper features, and superior dimensional accuracy in both conducting and insulating materials.
Specifications
| Laser parameters | 355nm, Energy/pulse>25uJ, Pulse width<350ps |
| Sample Stages (X, Y, Z) | Linear piezo stages 32mm, 25nm steps (X, Y) |
| Drilling and machining typical dimensions | Hole down to 6 micron, Laser focus 4 micron |
| Software | Python proprietary software – PulseCube Manager |
| Voltage | 110-250V, 50-60Hz |
| Overall Dimensions | 49x47x41cm |
| Total Weight | 40kg (incl. Laser power supply) |
Almax easyLab is committed to its policy of continuous improvement. Specifications may change without notice. easyLab and Diacell are registered trademarks of Almax easyLab.
Documents
We have compiled a series of technical documents (brochures, articles, technical drawings, …) which you might find useful to help you understand this product better.
Technical documentation
PulseCube Extended Leaflet (Technical)
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FAQs
What is the smallest hole which can be drilled?
During the development phase, we have managed to drill holes down to 6 microns in a circular motion.
What is the thickest material the PulseCube can cut?
The PulseCube can cut through 250-300 microns of metallic material. The use of the more advanced features of PulseCube Manager enable to cut thicker materials. We recommend to use the advanced drilling mode with features such as Drop per Loop, Internal Loops.
What is the typical field of view of the camera?
In PulseCube manager, the object image is approximately 750 x 950 micron (X,Y). By using the Scan function, it is possible to visualise 5×5, 7x7mm or larger area.
Does the PulseCube have other wavelengths?
The PulseCube only comes with a high-quality UV laser at 355nm. Our measurements have shown that this type of wavelength gives the best finish quality.
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